Ambient controlled transfer module and process system

ABSTRACT

Methods and apparatus for processing a substrate are provided herein. In one implementation, the apparatus includes a load lock chamber coupled to a transfer chamber. The transfer chamber is coupled to a thermal process chamber and a substrate is transferred between each of the load lock chamber, the transfer chamber, and the thermal process chamber. In other implementations, a process platform having a load lock chamber, a transfer chamber, and a thermal process chamber is disclosed. Methods of measuring oxygen concentration in a load lock chamber via evacuation of a transfer chamber are also described herein.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims benefit of United States Provisional PatentApplications, Ser. Nos. 62/466,527; 62/466,533; 62/466,535; and62/466,539 all filed Mar. 3, 2017, and each is incorporated herein byreference in its entirety.

BACKGROUND Field

Implementations of the present disclosure generally relate to asubstrate process and transfer apparatus. More specifically,implementations described herein relate to an ambient controlledtransfer module and process system.

Description of the Related Art

Reliably producing sub-half micron and smaller features is one of thekey technology challenges for next generation very large scaleintegration (VLSI) and ultra large scale integration (ULSI) ofsemiconductor devices. However, as the limits of circuit technology arepushed, the shrinking dimensions of VLSI and ULSI technology have placedadditional demands on processing capabilities.

In advanced node devices, metals and barrier layer materials are oftenutilized in contact integration schemes. However, oxidation of variousmaterials, such as metal and dielectrics, utilized in the contactintegration schemes can lead to adhesion issues and de-wetting ofcontact structure materials. Oxidation of the various materials may alsoincrease contact resistance. As a result, poor adhesion of the contactstructure and increased contact resistance may result in poor deviceperformance of device failure.

Accordingly, what is needed in the art are improved apparatus andmethods for preventing oxidation of device structures during variousstages of device fabrication.

SUMMARY

In one implementation, a substrate processing apparatus includes afactory interface, a substrate transfer module for generating asubstantially inert environment at about atmospheric pressure. Thesubstrate transfer module includes a load lock chamber coupled to thefactory interface, the load lock chamber having a chamber body defininga process volume and a purge gas port in fluid communication with theprocess volume and a transfer chamber coupled to the load lock chamber.A process module is also coupled to the substrate transfer module,wherein the process module comprises a plurality of process chamber.

In another implementation, a substrate processing apparatus includes afactory interface and the factory interface comprises a first transferchamber having a first robot disposed therein. The apparatus alsoincludes a substrate transfer module for generating a substantiallyinert environment at about atmospheric pressure. The substrate transfermodule comprises a load lock chamber coupled to the first transferchamber and a second transfer chamber having a second robot disposedtherein, wherein second transfer chamber is coupled to the load lockchamber. The apparatus also includes a process module coupled to thesubstrate transfer module, wherein the process module comprises aprocess chamber and the process chamber is coupled to the secondtransfer chamber.

In another implementation, a substrate processing apparatus includes afactory interface and the factory interface includes a first transferchamber having a first robot disposed therein and a plurality of frontopening unified pods coupled to the first transfer chamber. Theapparatus also includes a substrate transfer module for generating asubstantially inert environment at about atmospheric pressure. Thesubstrate transfer module includes an atmospheric load lock chambercoupled to the first transfer chamber and a second transfer chamberhaving a second robot disposed therein, wherein the second transferchamber is coupled to the load lock chamber. The apparatus also includesa process module coupled to the substrate transfer module, wherein theprocess module comprises a laser thermal process chamber and the laserthermal process chamber is coupled to the second transfer chamber.

In another implementation, a substrate transfer apparatus comprises aload lock chamber for generating a substantially inert environment atabout atmospheric pressure. The load lock chamber comprises a chamberbody defining a process volume, a pedestal disposed in the processvolume, a lid coupled to the chamber body opposite the pedestal, a purgegas port disposed through the lid, and an exhaust port disposed in thechamber body adjacent to the pedestal and opposite the purge gas port.The apparatus also includes a transfer chamber for generating asubstantially inert environment at about atmospheric pressure coupled tothe load lock chamber. The transfer chamber comprises a chamber bodydefining a transfer volume, a robot disposed in the transfer volume, aplurality of purge gas ports disposed in the chamber body, and anexhaust port disposed in the chamber body opposite the plurality ofpurge gas ports.

In another implementation, a substrate processing apparatus comprises aload lock chamber for generating a substantially inert environment atabout atmospheric pressure. The load lock chamber comprises a chamberbody defining a process volume a pedestal disposed in the processvolume, a fluid conduit disposed within the pedestal, a plurality ofrecesses formed along a circumference of the pedestal, and a pluralityof lift pins disposed in the process volume, each lift pin disposedadjacent to one or more of the plurality recesses. The apparatus alsoincludes a lid coupled to the chamber body opposite the pedestal, adiffuser plate coupled to the lid at a center region of the lid, whereina portion of a bottom surface of the lid is tapered extending radiallyoutward from the diffuser plate, a purge gas port disposed through thediffuser plate, and an exhaust port disposed in the chamber bodyadjacent to the pedestal and opposite the purge gas port.

In another implementation, a substrate transfer apparatus comprises atransfer chamber for generating a substantially inert environment atabout atmospheric pressure coupled to the load lock chamber. Thetransfer chamber comprises a chamber body defining a transfer volume, anoptically transparent lid coupled to the chamber body, and a robotdisposed in the transfer volume, wherein a blade of the robot ismanufactured from quartz. The apparatus also includes a plurality ofpurge gas ports disposed in the chamber body, a plurality of diffusersextending from the purge gas ports, an exhaust port disposed in thechamber body opposite the plurality of purge gas ports, an exhaustconduit coupled to the exhaust port, and an oxygen sensor in fluidcommunication with the transfer volume via the exhaust conduit and theexhaust port.

In another implementation, a platform apparatus comprises a firstfactory interface, a second factory interface coupled to the firstfactory interface, and a tunnel chamber disposed between the firstfactory interface and the second factory interface, wherein the tunnelchamber comprises a transfer chamber and a plurality of load lockchamber. The apparatus also includes a first transfer module coupled tothe first factory interface, a process module coupled to the firsttransfer module, a central transfer chamber coupled to the secondfactory interface, and a plurality of process chambers coupled to thecentral transfer chamber, wherein at least one of the plurality ofprocess chambers is coupled to the central transfer chamber by a secondtransfer module.

In one implementation, a platform apparatus comprises a first factoryinterface, a transfer module coupled to the first factory interface, aprocess module coupled to the transfer module, a second factoryinterface, and a central transfer chamber coupled to the second factoryinterface. The apparatus also includes a tunnel chamber disposed betweenthe first factory interface and the central transfer chamber, whereinthe tunnel chamber comprises a transfer chamber and a plurality of loadlock chambers. The apparatus also includes a plurality of processchamber coupled to the central transfer chamber.

In one implementation, a substrate process method comprises transferringa substrate from a first chamber to a second chamber, isolating anenvironment of the second chamber from an environment of the firstchamber, removing oxidants from the environment of the second chamber,and cooling the substrate in the second chamber. The method alsoincludes opening a slit valve between the first chamber and the secondchamber, evacuating the environment of the first chamber, and analyzingthe first chamber exhaust to determine an oxygen concentration of theenvironment of the second chamber.

In one implementation, a substrate process method comprises transferringa substrate from a transfer chamber to a load lock chamber, closing aslit valve between the transfer chamber and the load lock chamber toisolate an environment of the load lock chamber from an environment ofthe transfer chamber, removing oxidants from the environment of the loadlock chamber, and cooling the substrate in the load lock chamber. Themethod also includes opening the slit valve between the transfer chamberand the load lock chamber, evacuating the environment of the transferchamber during opening of the slit valve, and analyzing the transferchamber exhaust to determine an oxygen concentration of the environmentof the load lock chamber during the cooling of the substrate.

In one implementation, a substrate transfer method comprisestransferring a substrate from a process chamber to a transfer chamber,transferring the substrate from the transfer chamber to a load lockchamber, and closing a slit valve between the transfer chamber and theload lock chamber to isolate an environment of the load lock chamberfrom an environment of the transfer chamber. The method also includesremoving oxidants from the environment of the load lock chamber, coolingthe substrate in the load lock chamber, opening the slit valve betweenthe transfer chamber and the load lock chamber, evacuating theenvironment of the transfer chamber during opening of the slit valve,and analyzing the transfer chamber exhaust to determine an oxygenconcentration of the environment of the load lock chamber during coolingof the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the presentdisclosure can be understood in detail, a more particular description ofthe disclosure, briefly summarized above, may be had by reference toimplementations, some of which are illustrated in the appended drawings.It is to be noted, however, that the appended drawings illustrate onlyexemplary implementations and are therefore not to be consideredlimiting of its scope, may admit to other equally effectiveimplementations.

FIG. 1 illustrates a schematic, plan view of a process system accordingto implementations described herein.

FIG. 2 illustrates a schematic, perspective view of a substrate transfermodule according to implementations described herein.

FIG. 3 illustrates a schematic, perspective view of a transfer chamberaccording to implementations described herein.

FIG. 4 illustrates a schematic, partial perspective view of the transferchamber of FIG. 3 according to implementations described herein.

FIG. 5 illustrates a schematic, cross-sectional view of a load lockchamber according to implementations described herein.

FIG. 6A illustrates a schematic, partial perspective view of the loadlock chamber of FIG. 5 according to implementations described herein.

FIG. 6B illustrates a schematic, cross-sectional view of a lift pin ofthe load lock chamber of FIG. 6A according to implementations describedherein.

FIG. 6C illustrates a schematic, cross-sectional view of a substratesupport feature of the load lock chamber of FIG. 6A according toimplementations described herein.

FIG. 7 illustrates a schematic, plan view of a process system accordingto implementations described herein.

FIG. 8 illustrates a schematic, plan view of a process system accordingto implementations described herein.

FIG. 9 illustrates a schematic view of a process platform according toimplementations described herein.

FIG. 10 illustrates a schematic view of a process platform according toimplementations described herein.

FIG. 11 illustrates operations of a method for transferring a substrateand measuring oxygen concentration in a load lock chamber according toimplementations described herein.

To facilitate understanding, identical reference numerals have beenused, where possible, to designate identical elements that are common tothe figures. It is contemplated that elements and features of oneimplementation may be beneficially incorporated in other implementationswithout further recitation.

DETAILED DESCRIPTION

Methods and apparatus for processing a substrate are provided herein. Inone implementation, the apparatus includes an ambient controlled loadlock chamber coupled to a transfer chamber. The transfer chamber may becoupled to a thermal process chamber, and in such cases a substrate istransferred between each of the load lock chamber, the transfer chamber,and the thermal process chamber. In other implementations, a processplatform having an ambient controlled load lock chamber, a transferchamber, and a thermal process chamber is disclosed. Methods ofmeasuring oxygen concentration in a load lock chamber by analyzingexhaust gas from a transfer chamber are also described herein.

FIG. 1 illustrates a schematic, plan view of a process system 100according to implementations described herein. The process system 100includes a factory interface 102, a substrate transfer module 104, and aprocess module 106. The factory interface 102 includes a factoryinterface (FI) transfer chamber 110 and the FI transfer chamber isconfigured to interface with one or more front opening unified pods(FOUPs) 108. In one implementation, the FI transfer chamber 110 has asingle robot disposed therein which transfers substrates between theFUOPs 108 and the substrate transfer module 104. In anotherimplementation, the FI transfer chamber 110 has a plurality of robots,for example, two robots, disposed therein. In this implementation, eachof the robots transfers substrates from one of the FOUPs 108 to adedicated portion of the substrate transfer module 104.

The substrate transfer module 104 includes one or more load lockchambers 112 and one or more transfer chambers 114. In the illustratedimplementation, the substrate transfer module 104 includes two load lockchambers 112 and two transfer chambers 114, however, it is contemplatedthat a greater or lesser number of load lock chamber 112 and transferchamber 114 pairs may be utilized in the process system 100.

Each load lock chamber 112 is coupled to the FI transfer chamber 110 ona first side of the load lock chamber 112 and each transfer chamber 114is coupled to a respective load lock chamber 112 on a second side of theload lock chamber 112 opposite the first side of the load lock chamber112. A first side of each transfer chamber 114 is coupled to therespective load lock chamber 112. The transfer chamber 114 has a robotdisposed therein and the transfer chamber 114 is in operablecommunication with the load lock chamber 112. For example, a substratemay be transferred between the transfer chamber 114 and the load lockchamber 112

The process module 106 includes one or more process chambers 116, eachof which is coupled to a respective transfer chamber 114 at a secondside of the transfer chamber 114 opposite the first side of the transferchamber 114. In the illustrated implementation, the process module 106includes two process chambers 116, however, it is contemplated that agreater number of process chambers may be utilized in the process module106. It should be noted that the various chambers may be coupled in aconfiguration that is not linearly aligned as shown in FIG. 1. Thus, thevarious couplings may be made at locations and sides of the chambersthat are not necessarily opposite.

In one implementation, the process chamber 116 is a thermal processingchamber, for example, a rapid thermal processing chamber. In certainimplementations, the process chamber 116 is a laser thermal processchamber. One example of a laser thermal process chamber is the ASTRA™thermal processing tool available from Applied Materials, Inc., SantaClara, Calif. In alternative implementations, the process chamber 116 isa lamp based thermal process chamber. Examples of a lamp based thermalprocess chamber include the RADIANCE®, RADIANCE® PLUS, and VULCAN™ rapidthermal processing tools, all of which are available from AppliedMaterials, Inc., Santa Clara, Calif. It is also contemplated that othertools from other manufacturers may be advantageously implementedaccording to the implementations described herein. In addition to theimplementations described above, it is contemplated that the processchamber 116 may also be an etch chamber, a deposition chamber, or acleaning chamber, depending upon the desired implementation.

In operation, a substrate to be processed is delivered to the factoryinterface 102 via the FOUPs 108. A robot in the FI transfer chamber 110removes the substrate from the FOUP 108 and transfers the substrate tothe load lock chamber 112. A robot disposed in the transfer chamber 114retrieves the substrate from the load lock chamber 112 and transfers thesubstrate to the process chamber 116 where the substrate is processed.After processing, the robot in the transfer chamber 114 retrieves thesubstrate from the process chamber 116 and transfers the substrate tothe load lock chamber 112. The robot in the FI transfer chamber 110 thenretrieves the substrate from the load lock chamber 112 and returns thesubstrate to the FOUP 108.

In implementations where the process chamber 116 is a thermal processingchamber, the substrate may be cooled in the load lock chamber 112 priorto transfer to the factory interface 102. The various chambers areisolated, one from the other, at appropriate times by use of sealingdoors (not shown) between the chambers, which are opened at appropriatetimes for passage of substrates between the chambers.

FIG. 2 illustrates a schematic, perspective view of the substratetransfer module 104 according to implementations described herein. Theillustrated substrate transfer module 104 includes a first load lockchamber 202 which is coupled to a first transfer chamber 204 and asecond load lock chamber 206 which is coupled to a second transferchamber 208. The first load lock chamber 202 and first transfer chamber204 define one of the substrate transfer modules 104, and the secondload lock chamber 206 and second transfer chamber 208 define another oneof the substrate transfer modules 104. Thus, the illustratedimplementation shows a pair of substrate transfer modules 104. The firstand second load lock chambers 202, 206 and the first and second transferchambers 204, 208 are similar to the load lock chamber 112 and transferchamber 114, respectively, described with regard to FIG. 1.

The load lock chambers 112 include a chamber body 210 which defines aprocess volume (not shown) which is sized to accommodate a substratetherein. The chamber body 210 may be sized to accommodate substrateshaving varying diameters, such as a 200 mm diameter, a 300 mm diameter,or a 450 mm diameter, among other sizes. The chamber body 210 is formedfrom a metallic material, such as aluminum, stainless steel, andcombinations thereof. In one implementation, the chamber body 210 ismachined from aluminum billet.

A first slit valve 212 formed in the body 210 is sized to accommodatepassage of a substrate therethrough. The first slit valve 212 isconfigured to mate with the factory interface 102 (FIG. 1) and a firstslit valve door 214 is coupled to the body 210 adjacent to the firstslit valve 212. In operation, the first slit valve door 214 opens andcloses the first slit valve 212 to enable access to the load lockchamber 112 by the robot disposed in the factory interface 102. The loadlock chamber 112 also includes a second slit valve (not shown) which isdisposed in the chamber body 210 opposite the first slit valve 212. Asecond slit valve door 216 is coupled to the body 210 adjacent to thesecond slit valve to open and close the second slit valve. The secondslit valve (described in greater detail with regard to FIG. 5) isdisposed adjacent to the transfer chamber 114. A purge gas conduit 218is also coupled to the chamber body 210 and is in fluid communicationwith the process volume.

The transfer chamber 114, which is coupled directly to the load lockchamber 112 in the implementation of FIG. 2, includes a chamber body220, a robot 224 disposed within the chamber body 220, and a lid 222.The chamber body 220 is formed from a metallic material, such asaluminum, stainless steel, and combinations thereof. In certainimplementations, similar to the load lock chamber 112, the chamber body220 is fabricated from aluminum billet. The robot 224 is configured totransfer substrates, such as the illustrated substrate 230, between theload lock chamber 112 and the process chamber 116. As a result, thereach of the robot is sufficient to extend into the load lock chamber112 and the process chamber 116 to position and retrieve substrates fortransfer operations.

The lid 222 removably coupled to a top of the chamber body 220. In oneimplementation, the lid 222 is formed from an optically transparent orpredominantly optically transparent material to enable viewing insidethe transfer chamber 114. In one implementation, the lid 222 is formedfrom a polymeric material, such a polycarbonate or the like. Althoughnot illustrated, a plurality of apertures are formed in the body 220 ofthe transfer chamber 114 to enable passage of the substrate 230therethrough. A plurality of local center finding (LCF) sensors 226, 228are also coupled to the chamber body 220. The LCF sensors are opticallycoupled with the apertures to view substrates passing into and out ofthe transfer chamber 114.

A first LCF sensor 226 is coupled to the chamber body 220 adjacent theload lock chamber 112 and is configured to detect a position of thesubstrate 230 as the substrate 230 travels from the load lock chamber112 to the transfer chamber 114. A second LCF sensor 228 is coupled tothe chamber body 220 opposite the first LCF sensor 226 and adjacent tothe process chamber 116. Similar to the first LCF sensor 226, the secondLCF sensor is configured to detect a position of the substrate 230 asthe substrate 230 travels from the transfer chamber 114 to the processchamber 116. Each of the LCF sensors 226, 228 also detect the positionof the substrate during transfer from the transfer chamber 114 to theload lock chamber 112 and from the process chamber 116 to the transferchamber 114, respectively.

FIG. 3 illustrates a schematic, perspective view of the transfer chamber114 according to implementations described herein. The chamber body 220includes a top surface 302 which supports the LCF sensors 226, 228 andthe lid 222. The lid 222 has a plurality of handles 304 attached theretoto enable efficient removal of the lid 222 from the chamber body 220. Byutilizing an optically transparent material for the lid 222, it iscontemplated that other view ports formed in the chamber body 220 areunnecessary, thereby simplifying the chamber body manufacturing process.Moreover, the lid 222, which may be coupled to the chamber body 220 bythreaded fasteners or the like, is easily removable should maintenancebe performed, thereby reducing down time and improving operatingefficiency. The lid 222 may be coupled to the chamber body 220 by asuitable fastening and sealing system. In one implementation, the lid222 may be fastened to the chamber body 220 by a plurality of screws316, which may be unscrewed to unfasten the lid 222. A seal member (notshown) may be disposed between the lid 222 and the chamber body 220 toprovide vacuum seal when the transfer chamber 114 is at operatingpressure.

A process chamber port adapter 306 is coupled to the chamber body 220 ona surface of the chamber body 220 which couples to the process chamber116 (not shown). In one implementation, the port adapter 306 is coupledto the chamber body 220 by a plurality of fasteners, such as bolts orthe like. A mounting plate 308 is coupled to the port adapter 306 toenable secure coupling of the transfer chamber 114 to the processchamber 116. The mounting plate 308 is removably coupled to the portadapter 306 and may be replaced with a different adapter plate should itbe desirable to utilize the substrate transfer module 104 with differenttypes of process chambers.

A slit valve 310 is an opening that is formed in, and extends through,each of the chamber body 220, the port adapter 306, and the mountingplate 308. Similar to other slit valves described herein, the slit valve310 is sized to accommodate passage of the substrate 230 therethrough.The slit valve 310 is opened and closed by a slit valve door 312 whichis coupled to either the chamber body 220 or the port adapter 306,depending upon the desired implementation.

FIG. 4 illustrates a schematic, partial perspective view of the transferchamber 114 of FIG. 3 according to implementations described herein. Thelid 222 has been removed and a portion cut away to more clearlyillustrate internal aspects of the transfer chamber 114. The chamberbody 220 includes a first base plate 402 and a second base plate 420. Inone implementation, the first base plate 402 is part of the chamber body220. In an alternate implementation, the first base plate 402 is aninsert removably coupled to the chamber body 220. The second base plate420 is also coupled to the chamber body 220. In one implementation, thesecond base plate 420 is formed from the same material as the first baseplate 402 and the chamber body 220. The second base plate 420 may alsobe an insert fastened to the chamber body 220. The second base plate 420is annular in shape with an opening through which the robot 224 extends.An actuator (not shown), which may be a rotational actuator or a z-eactuator, located outside the chamber body 220 couples to the robot 224through the opening in the second base plate 420. The first base plate402 is also toroidal in shape and surrounds the second base plate 420.

An exhaust port 404 is formed in the base plate 402 adjacent the secondslit valve door 216. The exhaust port 404 may be centered relative tothe second slit valve door 216 (i.e. located such that a center of theexhaust port 404 lies on a line bisecting, and perpendicular to, theslit valve door 216) or may be offset from the center of the second slitvalve door 216. The exhaust port 404 extends through the base plate andprovides fluid communication between a volume of the transfer chamber114 internal to the chamber body 220 and an exhaust (not shown).

A plurality of purge gas ports 406, 408 are formed in the first baseplate 402 adjacent the slit valve door 312. A first purge gas port 406is disposed in the first base plate 402 azimuthally between about 90°and about 180° from the exhaust port 404 in a first direction. A secondpurge gas port 408 (shown in phantom) is disposed in the first baseplate 402 azimuthally between about 90° and about 180° from the exhaustport 404 in a second direction opposite the first direction. Moregenerally, the purge gas ports 406, 408 are disposed through the firstbase plate 402 opposite the exhaust port. The azimuthal displacement ofthe first and second purge gas ports 406 and 408 from the exhaust port404 may be the same, in opposite directions, or may be different.

An optional exhaust port 414 may be disposed in the first base plate 402opposite the exhaust port 404. The optional exhaust port 414 may beutilized should it be desirable for a higher volume of fluid flow to beexhausted from the transfer chamber 114. In an alternate implementation,the exhaust port 404 may be disposed in the first base plate 402 at theposition of the optional exhaust port 414 and the purge gas ports 406,408 may be disposed in an orientation similar to that illustrated butadjacent the second slit valve door 216 instead of adjacent the slitvalve door 312. In other words, the transfer chamber 114 may have one ortwo exhaust ports 404 (and 414), which may be located adjacent to theslit valve doors 216, or 312, or both, and the purge gas ports 406 and408 may be located adjacent to the slit valve doors 216 or 312. Itshould additionally be noted that the transfer chamber 114 may have one,two, three, or four of the purge gas ports 406, which may be locatedadjacent to the slit valve doors 216, or 312, or both.

A plurality of diffusers 410, 412 are coupled to the first base plate402 in the first purge gas port 406 and the second purge gas port 408,respectively. The diffusers 410, 412 extend from the purge gas ports406, 408 in a plane above the first base plate 402. Each of the purgegas ports 406, 408 are fluidly coupled to a purge gas source (not shown)and the purge gas ports 406, 408 enable introduction of purge gas intothe transfer chamber 114. Suitable examples of purge gases include inertgases, such as nitrogen, helium, and argon or the like.

In operation, the transfer chamber 114 may be exhausted from atmosphericpressure to a reduced pressure of between about 2 Torr and about 5 Torr.Subsequently, purge gas may be introduced to the transfer chamber 114.The purge gas travels through the purge gas ports 406, 408 where it isdeflected by the diffusers 410, 412 throughout the transfer chamber 114.The purge gas may be delivered through the purge gas ports 406, 408 at arate of between about 10 standard liters per minute (slm) and about 200slm, such as between about 50 slm and about 90 slm. It is contemplatedthat the environment within the transfer chamber 114, when purgedaccording to the implementations described herein, may achieve an oxygenconcentration of less than about 0.1 parts per million (ppm)

Generally, the transfer chamber 114 may be maintained at aboutatmospheric pressure. In one implementation, purge gas may be utilizedto remove non-inert or undesirable gases from the transfer chamber 114.In another implementation, purge gases may be utilized to pressurize thetransfer chamber 114 to slightly above atmospheric pressure. In thisimplementation, an environment within the transfer chamber 114 ismaintained at a pressure of between about 1 pound per square inch (psi)and about 10 psi, such as about 5 psi above atmospheric pressure. Bymaintaining the transfer chamber environment at a slightly positivepressure, it is believed that maintenance of an inert and cleanenvironment within the transfer chamber 114 may be achieved by ensuringthat any gas leaks in the chamber flow toward the exterior of thechamber, thus preventing intrusion of environmental gases into thechamber. In this way, a substantially inert environment may be achieved.In one implementation, the substantially inert environment issubstantially devoid of oxidants, such as oxygen, air, CO₂, water vapor,and the like.

The robot 224 rotates about a central axis and has an arm 416 whichenables substrate transfer in the X and Y directions. The arm 416 iscoupled to a blade 418 which supports the substrate 230 during transfer.The blade 418 may be manufactured from a material such as quartz. Byutilizing quartz, the blade is capable of supporting the substrate 230after processing in the process chamber 116 when the substrate 230 mayhave a temperature of greater than about 500° C. In one implementation,a portion of the arm 416 which is coupled to the blade 418 may befabricated from an alloy material, such as Nitronic® 60, to minimizestress on the blade 418 due to thermal expansion.

In addition to the implementations described above, the transfer chamber114 may be actively cooled to facilitate cooling of the substrate 230after processing in the process chamber 116. In this implementation,fluid may be flowed through channels formed in the body 220 or byintroduction of a cooled purge gas into the transfer chamber 114 via thepurge gas ports 406, 408. It is believed that by cooling the transferchamber 114, the amount of time the substrate 230 is cooled in the loadlock chamber 112 post processing may be reduced.

FIG. 5 illustrates a schematic, cross-sectional view of the load lockchamber 112 according to implementations described herein. The load lockchamber 112 includes the chamber body 210 which defines an internalvolume 502. A substrate support 508 is disposed within the internalvolume 502 and a plurality of fluid conduits 510 are disposed within thesubstrate support 508. The fluid conduits 510 may traverse through thepedestal in a spiral path, a circuitous path, a serpentine path, orother tortured path. The fluid conduits 510 are disposed adjacent to asubstrate supporting surface 509 of the substrate support 508 to provideproximity of the fluid conduits 510 to a substrate in contact with thesubstrate supporting surface 509. Such proximity promotes thermaltransfer efficiency between the substrate and a fluid circulatingthrough the fluid conduits 510. In one implementation, a distancebetween an outer diameter of each fluid conduit 510 and the substratesupporting surface is about 0.1 mm to about 5 mm, for example about 1mm.

The fluid conduits 510 are also fluidly coupled to a cooling fluidsource 512. Suitable cooling fluids include water, water-based ethyleneglycol mixtures, a perfluoropolyether (e.g., Galden® fluid), oil-basedthermal transfer fluids, liquid metals (such as gallium or galliumalloy) or other similar fluids. In one implementation, the substratesupport 508 may be maintained at a temperature of between about 10° C.and about 30° C., such as about 20° C. during cooling of the substrate230. Optionally, a heater 516 may also be provided in the internalvolume 502 should heating of the substrate 230 be desirable. The heater516 may be a ceramic heater or the like or may be a resistive heaterdisposed within, or otherwise in thermal contact (for example adjacentto), the substrate support 508. In the implementation of FIG. 5, anoptional heater 516 is shown adjacent to the substrate support 508 in arecess 511 surrounding the substrate support 508. The recess 511 is opento the internal volume 502 so that the substrate support 508 has apedestal shape. Alternately, the substrate support 508 may be a platethat contacts a sidewall 513 of the load lock 112, and the optionalheater 516 and recess 511 may be separated from the internal volume 502by the substrate support 508.

A lid 506 is coupled to the chamber body 210 opposite the substratesupport 508. The lid 506 may be fabricated from a metallic materialsimilar to, or the same as, the materials selected for the chamber body210. A diffuser plate 504 may be coupled to and disposed at a centralregion of the lid 506. The diffuser plate 504 is in fluid communicationwith the internal volume 502 and the purge gas conduit 218. The purgegas conduit 218 is coupled to a purge gas source 514 and the purge gasconduit extends through the diffuser plate 504 adjacent the internalvolume 502.

A bottom surface 534 of the lid 506 extends radially inward from thechamber body 210 to the diffuser plate 504. A portion 536 of the bottomsurface 534 of the lid 506 is tapered extending radially outward fromthe diffuser plate 504. It is believed that the topography of the lidbottom surface 534, in combination with delivering purge gas through thelid 506 and the diffuser plate 504 provides for improved distribution ofpurge gas throughout the internal volume 502.

In operation, the load lock chamber 112 is maintained, for a substantialportion of substrate cooling operations, at substantially atmosphericpressure. However, the composition of the environment in the internalvolume 502 is controlled to be a substantially inert environment. Toensure a substantially inert environment (i.e. an environmentsubstantially devoid of oxidants or reducers, for example, an O₂concentration less than 1 ppm) the load lock chamber 112 is exhaustedfrom approximately atmospheric pressure to a reduced pressure of betweenabout 2 Torr and about 5 Torr. Subsequently, the internal volume 502 ispurged with an inert gas, such as nitrogen, helium, or argon or thelike. In one implementation, a flow rate of the purge gas during purgingof the internal volume 502 is between about 2 slm and about 100 slm, forexample, about 50 slm. As a result of the purging, the pressure iselevated to approximately atmospheric pressure or slightly aboveatmospheric pressure, such as between about 1 psi and about 10 psi, forexample, about 5 psi, above atmospheric pressure.

A second slit valve 518 is disposed in the chamber body 210 opposite thefirst slit valve 212. The first slit valve 212 and the second slit valve518 are disposed along the same plane. The second slit valve 518 isdisposed adjacent the transfer chamber 114 and is opened and closed bythe second slit valve door 216. As previously described, the exhaustport 404 of the transfer chamber 114 is disposed adjacent the secondslit valve door 518.

During substrate transfer and substrate cooling in the load lock chamber112, it is often desirable to maintain the internal volume 502 in anenvironment having substantially no oxygen. When the second slit valvedoor 216 is opened, the environment of the load lock internal volume 502can be detected by analyzing the exhaust of the transfer chamber 114obtained from the exhaust port 404. Proximity of the exhaust port 404 tothe second slit valve door 216 allows gases from the load lock chamber112 to flow into the exhaust port 404 through the second slit valve 518when the second slit valve door 216 is open.

The transfer chamber 114 includes an exhaust conduit 520 coupled to andin fluid communication with the exhaust port 404. The exhaust conduit520 is in fluid communication with an exhaust outlet 532. A pump 530 iscoupled to the exhaust conduit 520 between the exhaust outlet 532 andthe exhaust port 404 and a check valve 528 is disposed in the exhaustconduit 520 between the pump 530 and the exhaust port 404. Duringpumping of the transfer chamber 114, gases flow through the exhaust portto the exhaust outlet 532.

An oxygen sensor 522 is in fluid communication with the exhaust conduit520 via a first conduit 524 and a second conduit 526. The oxygen sensor522 has a pump disposed therein and can pull exhaust gas from theexhaust conduit 520 for sampling via the first conduit 524. Alternately,the oxygen sensor 522 may rely on differential pressure across the checkvalve 528 to flow gas through the oxygen sensor 522, thus omitting theneed for a separate pump in the oxygen sensor 522. The first conduit 524is coupled to the exhaust conduit 520 between the exhaust port 404 andthe check valve 528. The second conduit 526 extends from the oxygensensor 522 to the exhaust conduit 520 between the check valve 528 andthe pump 530.

In operation, the pump 530 draws gases from the transfer chamberenvironment, which also contains fluids from the load lock chamberenvironment when the second slit valve 518 is open, to the exhaustoutlet 532. During evacuation of the transfer chamber 114, the oxygensensor 522 draws a sampling volume of exhaust fluid, analyzes theexhaust for oxygen, and returns the exhaust to the exhaust conduit 520.Suitable examples of the oxygen sensor which may be implementedaccording to the implementations described herein include the Model 3100O₂ Analyzer, available from Neutronics, Inc., Exton Pa. It iscontemplated that other O₂ analyzers from other manufacturers capable ofdetecting an oxygen concentration of less than about 1 ppm may also beutilized according to the implementations described herein.

FIG. 11 illustrates operations of a method 1100 for transferring asubstrate and measuring oxygen concentration in a load lock chamberaccording to implementations described herein. At operation 1110, thesubstrate 230 is transferred from the process chamber 116 to thetransfer chamber 114. At operation 1120, the substrate 230 istransferred to the load lock chamber 112.

At operation 1130, the load lock chamber environment is isolated fromthe transfer chamber environment by closing the second slit valve 518.Oxygen is removed from the load lock chamber 112 by purging the loadlock environment at operation 1140. At operation 1150, the substrate 230is cooled in an oxygen deficient, oxidant deficient, and/orsubstantially inert environment. By allowing the substrate to betransferred and cooled in a substantially inert and oxidant freeenvironment, it is believed that subsequent contact structure formationprocesses may be improved.

At operation 1160, the second slit valve 518 is opened between the loadlock chamber 112 and the transfer chamber 114. At operation 1170, thetransfer chamber environment is exhausted during opening of the secondslit valve 518. At operation 1180, the transfer chamber exhaust isanalyzed to determine the oxygen concentration of the load lock chamberenvironment during substrate cooling. It is also contemplated that theinternal volume 502 of the transfer chamber 114 may be analyzed foroxygen concentration utilizing the oxygen sensors.

Thus, it is possible to determine whether the substrate 230 has beencooled in a substantially inert environment. If the oxygen sensor 522determines the oxygen concentration is too great, for example, aboveabout 1 ppm, data can be generated indicating the substrate 230 wasexposed to oxygen at which time the operator of the process system 100can determine what remedial measures are to be implemented, if any.

FIG. 6A illustrates a schematic, partial perspective view of the loadlock chamber of FIG. 5, with the lid 506 removed for clarity, accordingto implementations described herein. The chamber body 210 includessidewalls 628 which at least partially surround the substrate support508. The sidewalls 628 may be fabricated from the same materialsutilized to form the chamber body 210 in one implementation. In anotherimplementation, the sidewalls 628 may be a process kit which isdetachable from the chamber body 210. Examples of suitable materialsutilized to fabricate the sidewalls 628 include aluminum, stainlesssteel, and combinations thereof, or various ceramic materials in thecase of a process kit.

An exhaust port 626 is formed in the sidewalls 628 and the exhaust port626 is in fluid communication with the internal volume 502. The exhaustport 626 is also in fluid communication with a pump or exhaust (notshown). In operation, the load lock chamber 112 may be pumped down viathe exhaust port 626 to a pressure of between about 2 Torr and about 5Torr to remove all or substantially all of the oxygen that may bepresent in the internal volume 502. A purge gas, such as nitrogen or thelike, is delivered to the internal volume 502 and the pressure iselevated to about atmospheric pressure or slightly above atmosphericpressure. In one implementation, the purge gas elevates a pressurewithin the internal volume 502 to between about 1 psi and about 10 psiabove atmospheric pressure. It is believed that utilizing a slightlypositive pressure reduces or eliminates the probability of oxygenentering the load lock chamber 112 during substrate cooling.

The load lock chamber 112 also includes a plurality of lift pins 602.The plurality of lift pins 602 are spaced about a circumference of thesubstrate support 508. In the illustrated implementation, three liftpins 602 are shown, however, it is contemplated that a greater number oflift pins may also be utilized. The substrate support 508 has recesses604 formed therein which are sized to accommodate the lift pins 602,which extend laterally toward a center of the substrate support 508. Therecesses 604 therefore extend radially from an edge of the substratesupport toward the center thereof. Similar to the lift pins 602, therecesses 604 are spaced about the circumference of the substrate support508. In one implementation, the recesses 604 and the lift pins 602 aredisposed at corresponding locations about the circumference of thesubstrate support 508. In another implementation, the recesses 604 havea semi-circular shape, however it is contemplated that other shapes maybe utilized to accommodate the lift pins 602.

In one implementation, the lift pins 602 and recesses 604 are disposedadjacent to the chamber body 210 on sides which are perpendicular to thesides having the slit valve doors 214, 216 coupled thereto. In oneimplementation, one of the lift pins 602 is disposed opposite the othertwo lift pins 602. The position of the lift pins 602 relative to thesubstrate support 508 and substrate transfer path enables the substrate230 to be supported by the lift pins 602 and substrate support 508without changing the transfer path of the substrate 230.

FIG. 6B illustrates a schematic, cross-sectional view of one of the liftpins 602 of the load lock chamber 112 of FIG. 6A according toimplementations described herein. Each lift pin 602 includes a shaft606, a first extension 608 coupled to and extending from the shaft 606,and a second extension 610 coupled to and extending from the shaft 606.At least one of the first extension 608 and the second extension 610 isattached to the shaft 606 at a location between a first end of the shaft606 and a second end of the shaft 606. The first extension 608 may beattached between the first end and second end of the shaft 606, whilethe second extension 610 is attached at the second end of the shaft 606.

Each of the first and second extensions 608, 610 extends laterally fromthe shaft 606, for example at 90° angles. Each of the extensions 608,610, may extend from the shaft 606 at 90° angles, or another angle thatsimilarly enables supporting a substrate. For example, the secondextension 610 may form a 90° angle with the shaft 606 while the firstextension 608 extends laterally away from the shaft 606 and from thesecond extension 610. Additionally, each of the first and secondextensions 608, 610 are shown as straight members extending linearlyaway from the shaft 606, but one or more of the extensions 608, 610 maybe non-linear. For example, one or more of the first and secondextensions 608, 610 may be angled members having a first portion formingan angle with the shaft 606 and a second portion forming an angle withthe first portion.

The shaft 606 is disposed radially outward from an edge of the substratesupport 508 and the first and second extensions 608, 610 extend radiallyinward from the shaft 606. In one implementation, the first and secondextensions 608, 610 extend radially inward of the substrate support 508outer edge.

The first extension 608 and second extension 610 are spaced apart by adistance 620 which is suitable to accommodate positioning and support ofthe substrate 230 on the first extension. In one implementation, thedistance 620 is between about 10 millimeters (mm) and about 30 mm, suchas about 20 mm. The first extension 608 includes a top surface 612 whichhas a first support ball 616 disposed therein. Similar to the firstextension 608, the second extension 610 has a top surface 614 which hasa second support ball 618 disposed therein. The first and second supportballs 616, 618 are coupled to the top surfaces 612, 614, respectively,and extend above the top surfaces 612, 614. When the substrate 230 issupported by the lift pins 602, the substrate 230 contacts and rests onthe support balls 616, 618. Examples of suitable materials forfabricating the support balls 616, 618 include various ceramicmaterials, such as silicon nitride or silicon carbide. While the supportballs 616, 618 are described herein as being spherical in shape, it iscontemplated that the support balls 616, 618 may be oval pads, roundedrectangles, protrusions from the top surfaces 612, 614, or the like.

Referring back to FIG. 6A, the substrate support 508 also includes aplurality of contact balls 622 which are disposed in a top surface ofthe substrate support 508. The contact balls 622 are spaced apart suchthat the substrate 230 is evenly supported during cooling processes inthe load lock chamber 112. Similar to the support balls 616, 618, thecontact balls 622 are fabricated from one or more ceramic materials suchas silicon nitride or silicon carbide.

In operation, the lift pins 602 are elevated to a loading/unloadingposition where the first extension 608 is disposed above the top surfaceof the substrate support 508. A substrate which has not been processedis placed on the second extension 610 when the substrate is transferredfrom the factory interface 102. A substrate which has been processed bythe process chamber 116 is placed on the first extension 608 by therobot 224 of the transfer chamber 114. The lift pins 602 are retractedfrom the loading/unloading position to a process position where thefirst extension 608 is disposed in the recess 604 and the substrate issupported by the contact balls 622 to cool the processed substrate.

After the processed substrate has been sufficiently cooled, the liftpins 602 are extended from the process position to the loading/unloadingposition during placement of the substrates on the lift pins 602. Arobot from the factory interface 102 retrieves the processed substratesupported by the first extension 608. The unprocessed substratesupported by the second extension 610 is retrieved by the robot 224 andtransferred through the transfer chamber 114 to the process chamber 116.Accordingly, the load lock chamber 112 provides for improved efficiencyin transporting and cooling substrates in an environment with no orsubstantially no oxygen.

FIG. 6C illustrates a schematic, cross-sectional view of the substratesupport 508 and contact balls 622 of FIG. 6A according toimplementations described herein. The contact balls 622, which arecoupled to the pedestal, such as by press fitting or the like, extendabove the top surface of the substrate support 508 a distance 624. Inone implementation, the distance 624 is between about 0.01 inches andabout 0.03 inches. It is contemplated that the distance 624 may bemodulated to influence the cooling rate of the substrate 230. Forexample, a smaller distance 624 may provide for a faster cooling rate ofthe substrate 230 while a greater distance 624 may provide for a slowercooling rate.

FIG. 7 illustrates a schematic, plan view of a process system 700according to implementations described herein. The process system 700incudes a factory interface 702, a substrate transfer module 704, and aprocess module 706. The factory interface 702 includes a plurality ofFOUPs 708 and an Fl transfer chamber 710. The substrate transfer module704 includes a plurality of load lock chambers 712 and a transferchamber 714. The load lock chambers 712 are coupled to the FI transferchamber 710 and the transfer chamber 714 is coupled to the load lockchambers 712. In one implementation, the transfer chamber 714 is asingle chamber 716 having a plurality, such as two, transfer robotsdisposed therein. In one implementation, the load lock chambers 712 andtransfer chamber 714 are similar to the load lock chamber 112 andtransfer chamber 114, respectively.

The process module 706 includes a plurality of process chambers 718,such as thermal processing chambers. In one implementation, the processchambers 718 are rapid thermal process chambers, such as laser thermalprocess chambers. In other implementations, the process chambers 718 maybe deposition chambers, etch chambers, cleaning chambers, and the likedepending upon the desired implementation. By utilizing a transferchamber 714 having a single chamber 716, substrates may be transferredbetween the robots in the transfer chamber 714 to improve substratetransfer efficiency.

FIG. 8 illustrates a schematic, plan view of a process system 800according to implementations described herein. The process system 800incudes a factory interface 802, a substrate transfer module 804, and aprocess module 806. The factory interface 802 includes a plurality ofFOUPs 808 and an Fl transfer chamber 810. The substrate transfer module804 includes a load lock chamber 812 and a plurality of transferchambers 814. In one implementation, the load lock chamber 812 and theplurality of transfer chambers 814 are similar to the load lock chamber112 and the transfer chamber 114, respectively.

The load lock chamber 812 is disposed between the transfer chambers 814and the robots in each of the transfer chambers 814 can access the loadlock chamber 812. The load lock chamber 812 is coupled to the factoryinterface 802 and receives substrates from the FI transfer chamber 810.The transfer chambers 814 retrieve substrates from the centrallydisposed load lock chamber 812 and transfer the substrates to theprocess module 806.

Similar to the process module 706, the process module 806 includes aplurality of process chambers 818, such as thermal processing chambers.In one implementation, the process chambers 818 are rapid thermalprocess chambers, such as laser thermal process chambers. In otherimplementations, the process chambers 818 may be deposition chambers,etch chambers, cleaning chamber, and the like depending upon the desiredimplementation.

FIG. 9 illustrates a schematic view of a process platform 900 accordingto implementations described herein. The platform 900 is contemplated tobe modular in nature a capable of being re-arranged to best suit processcapabilities. It is also contemplated that various chambers andcomponents may be removed from or added to the platform 900 to enable awide range of application specific processes on a single platform.

The platform 900 includes a first factory interface 902 which has aplurality of FOUPs 936 coupled thereto. A plurality of substratetransfer modules 914 are coupled to the first factory interface 902. Thesubstrate transfer modules 914 include a load lock chamber 916 and atransfer chamber 918. In one implementation, the load lock chamber 916is similar to the load lock chamber 112. In another implementation, thetransfer chamber 918 is similar to the transfer chamber 114. Theplatform 900 also includes a process module 920. The process module 920includes a first process chamber 922 and a second process chamber 924.In one implementation, the first process camber 922 and the secondprocess chamber 924 are similar to the process chambers 116.

The platform 900 further includes a second factory interface 904 whichhas a plurality of FOUPs 934 coupled thereto. A central transfer chamber926 is coupled to the second factory interface 904 by a plurality ofload lock chambers 938. A plurality of process chambers 928, 930, 932are coupled to and disposed about the central transfer chamber 926. Inone implementation, the process chamber 928 is coupled directly to thecentral transfer chamber 926. Process chambers 930 and 932 are coupledto the central transfer chamber by individual substrate transfer modules914.

The arrangement of process chambers relative to transfer chambers andfactory interfaces may be improved by the utilization of the substratetransfer module 914. Improved substrate environment management andefficient substrate transfer may be achieved by utilizing the substratetransfer module 914 to facilitate improved platform flexibility.

The platform 900 also includes a tunnel chamber 906. The tunnel chamber906 is disposed between the first factory interface 902 and the secondfactory interface 904. The tunnel chamber 906 includes a first load lockchamber 908, a transfer chamber 912, and a second load lock chamber 910.The first load lock chamber 908 is disposed between the first factoryinterface 902 and the transfer chamber 912 of the tunnel chamber 906. Inone implementation, the load lock chambers 908, 910 are similar to theload lock chambers 112. Similarly, the transfer chamber 912 is similarto the transfer chamber 114. The second load lock chamber 910 isdisposed between the second factory interface 904 and the transferchamber 912 of the tunnel chamber 906. Thus, the tunnel chamber 906enables substrate transfer between the first factory interface 902 andthe second factory interface 904.

By coupling the factory interfaces 902, 904 with the tunnel chamber 906,substrates need not return to the FOUPS 936 after processing in theprocess module 920. Rather, substrate may be transferred through thetunnel chamber 906 to one or more of the process chambers 928, 930, 932for subsequent processing operations. In one example, the processchambers 928, 930, 932 may be any of a deposition chamber, an etchchamber, a cleaning chamber, or other chamber type having various otherprocess capabilities. Accordingly, subsequent processing operations maybe performed on a thermally processed substrate without exposing thesubstrate to oxygen during transfer between multiple platforms.

FIG. 10 illustrates a schematic view of a process platform 1000according to implementations described herein. The platform 1000 iscontemplated to be modular in nature and capable of being re-arranged tobest suit process capabilities. It is also contemplated that variouschambers and components may be removed from or added to the platform1000 to enable a wide range of application specific processes on asingle platform.

The platform 1000 includes a first factory interface 1002 which has aplurality of FOUPs 1036 coupled thereto. A plurality of substratetransfer modules 1014 are coupled to the first factory interface 1002.The substrate transfer modules 1014 include a load lock chamber 1016 anda transfer chamber 1018. In one implementation, the load lock chamber1016 is similar to the load lock chamber 112. In another implementation,the transfer chamber 1018 is similar to the transfer chamber 114. Theplatform 1000 also includes a process module 1020. The process module1020 includes a first process chamber 1022 and a second process chamber1024. In one implementation, the first process camber 1022 and thesecond process chamber 1024 are similar to the process chambers 116.

The platform 1000 further includes a second factory interface 904 whichhas a plurality of FOUPs 1034 coupled thereto. A central transferchamber 1026 is coupled to the second factory interface 1004 by aplurality of load lock chambers 1032. A plurality of process chambers1028, 1030 are coupled to and disposed about the central transferchamber 1026. In one implementation, the process chamber 1028 and theprocess chamber 1030 are coupled directly to the central transferchamber 1026.

The platform 1000 also includes a tunnel chamber 1006. The tunnelchamber 1006 is disposed between the first factory interface 902 and thecentral transfer chamber 1026. The tunnel chamber 1006 includes a firstload lock chamber 1008, a transfer chamber 1012, and a second load lockchamber 1010. The first load lock chamber 1008 is disposed between thefirst factory interface 1002 and the transfer chamber 1012 of the tunnelchamber 1006. In one implementation, the load lock chambers 1008, 1010are similar to the load lock chambers 112. Similarly, the transferchamber 1012 is similar to the transfer chamber 114.

The second load lock chamber 1010 is disposed between the centraltransfer chamber 1026 and the transfer chamber 1012 of the tunnelchamber 1006. Thus, the tunnel chamber 1006 enables substrate transferbetween the first factory interface 902 and the central transfer chamber1026. Utilizing the arrangement of the platform 1000, efficienciessimilar to those achieved with the platform 900 may also be achieved.

In one implementation, a substrate processing apparatus includes afactory interface, a substrate transfer module for generating asubstantially inert environment at about atmospheric pressure. Thesubstrate transfer module includes a load lock chamber coupled to thefactory interface, the load lock chamber having a chamber body defininga process volume and a purge gas port in fluid communication with theprocess volume and a transfer chamber coupled to the load lock chamber.A process module is also coupled to the substrate transfer module,wherein the process module comprises a plurality of process chamber.

In one implementation, the factory interface further comprises aplurality of front opening unified pods coupled to the factoryinterface.

In one implementation, the substrate transfer module comprises a pair ofload lock chambers.

In one implementation, the substrate transfer module comprises a pair oftransfer chambers.

In one implementation, the load lock chamber comprises an exhaust portin fluid communication with the process volume.

In one implementation, the load lock chamber comprises a pedestaldisposed in the process volume, wherein the pedestal has a plurality ofcooling fluid conduits formed therein.

In one implementation, the load lock chamber has a first slit valveformed in the chamber body adjacent to the factory interface and a firstslit valve door coupled to the chamber adjacent to the first slit valve.

In one implementation, the load lock chamber has a second slit valveformed in the chamber adjacent to the transfer chamber and a second slitvalve door coupled to the chamber adjacent to the second slit valve.

In one implementation, each of the process chambers is a rapid thermalprocess chamber.

In one implementation, each of the rapid thermal process chambers is alaser thermal process chamber.

In one implementation, each of the laser thermal process chambers isoperated at about atmospheric pressure.

In one implementation, a substrate processing apparatus includes afactory interface and the factory interface comprises a first transferchamber having a first robot disposed therein. The apparatus alsoincludes a substrate transfer module for generating a substantiallyinert environment at about atmospheric pressure. The substrate transfermodule comprises a load lock chamber coupled to the first transferchamber and a second transfer chamber having a second robot disposedtherein, wherein second transfer chamber is coupled to the load lockchamber. The apparatus also includes a process module coupled to thesubstrate transfer module, wherein the process module comprises aprocess chamber and the process chamber is coupled to the secondtransfer chamber.

In one implementation, the process chamber is a laser thermal processchamber.

In one implementation, the process chamber is a deposition chamber.

In one implementation, the process chamber is an etch chamber.

In one implementation, the load lock chamber comprises a chamber bodydefining a process volume, a purge gas port in fluid communication withthe process volume, and an exhaust port in fluid communication with theprocess volume.

In one implementation, the load lock chamber comprises a pedestaldisposed in the process volume and the pedestal has a plurality ofcooling fluid conduits formed therein.

In one implementation, a substrate processing apparatus includes afactory interface and the factory interface includes a first transferchamber having a first robot disposed therein and a plurality of frontopening unified pods coupled to the first transfer chamber. Theapparatus also includes a substrate transfer module for generating asubstantially inert environment at about atmospheric pressure. Thesubstrate transfer module includes an atmospheric load lock chambercoupled to the first transfer chamber and a second transfer chamberhaving a second robot disposed therein, wherein the second transferchamber is coupled to the load lock chamber. The apparatus also includesa process module coupled to the substrate transfer module, wherein theprocess module comprises a laser thermal process chamber and the laserthermal process chamber is coupled to the second transfer chamber.

In one implementation, the second transfer chamber comprises a chamberbody, an exhaust port disposed in the chamber body, and an exhaustconduit coupled to the chamber body extending from the exhaust port.

In one implementation, an oxygen sensor is in fluid communication withthe exhaust conduit.

In one implementation, a substrate transfer apparatus comprises a loadlock chamber for generating a substantially inert environment at aboutatmospheric pressure. The load lock chamber comprises a chamber bodydefining a process volume, a pedestal disposed in the process volume, alid coupled to the chamber body opposite the pedestal, a purge gas portdisposed through the lid, and an exhaust port disposed in the chamberbody adjacent to the pedestal and opposite the purge gas port. Theapparatus also includes a transfer chamber for generating asubstantially inert environment at about atmospheric pressure coupled tothe load lock chamber. The transfer chamber comprises a chamber bodydefining a transfer volume, a robot disposed in the transfer volume, aplurality of purge gas ports disposed in the chamber body, and anexhaust port disposed in the chamber body opposite the plurality ofpurge gas ports.

In one implementation, the load lock chamber further comprises a firstslit valve formed in the load lock chamber body and a second slit valveformed in the load lock chamber body opposite the first slit valve.

In one implementation, the load lock chamber further comprises a firstslit valve door coupled to the load lock chamber body adjacent to thefirst slit valve and a second slit valve door coupled to the load lockchamber body adjacent to the second slit valve.

In one implementation, the load lock chamber further comprises aplurality of lift pins disposed about the pedestal, wherein a pluralityof recesses are formed in the pedestal adjacent to the lift pins.

In one implementation, the each of the plurality of lift pins comprisesa shaft, a first extension coupled to and extending from the shaft, asecond extension coupled to and extending from the shaft, wherein thesecond extension is disposed adjacent to and spaced apart from the firstextension.

In one implementation, the first extension and the second extension arespaced apart a distance of between about 10 mm and about 30 mm.

In one implementation, support balls are coupled to each of the firstextension and the second extension.

In one implementation, the support balls are manufactured from a siliconnitride material.

In one implementation, the pedestal has a plurality of fluid conduitsformed therein.

In one implementation, a top surface of the pedestal has a plurality ofsilicon nitride material contact balls disposed therein.

In one implementation, the transfer chamber body comprises an opticallytransparent lid coupled to the chamber body.

In one implementation, the optically transparent lid is manufacturedfrom a polycarbonate material.

In one implementation, each of the plurality of purge gas ports has adiffuser extending therefrom.

In one implementation, the transfer chamber exhaust port is disposed inthe transfer chamber body adjacent to a region where the load lockchamber is coupled to the transfer chamber.

In one implementation, a substrate processing apparatus comprises a loadlock chamber for generating a substantially inert environment at aboutatmospheric pressure. The load lock chamber comprises a chamber bodydefining a process volume a pedestal disposed in the process volume, afluid conduit disposed within the pedestal, a plurality of recessesformed along a circumference of the pedestal, and a plurality of liftpins disposed in the process volume, each lift pin disposed adjacent toone or more of the plurality of recesses. The apparatus also includes alid coupled to the chamber body opposite the pedestal, a diffuser platecoupled to the lid at a center region of the lid, wherein a portion of abottom surface of the lid is tapered extending radially outward from thediffuser plate, a purge gas port disposed through the diffuser plate,and an exhaust port disposed in the chamber body adjacent to thepedestal and opposite the purge gas port.

In one implementation, the chamber body is manufactured from aluminumbillet.

In one implementation, the apparatus further comprises a first slitvalve disposed in a sidewall of the chamber body, a first slit valvedoor coupled to the chamber body adjacent to the first slit valve, asecond slit valve disposed in a sidewall of the chamber body oppositethe first slit valve, and a second slit valve door coupled to thechamber body adjacent to the second slit valve.

In one implementation, a substrate transfer apparatus comprises atransfer chamber for generating a substantially inert environment atabout atmospheric pressure coupled to the load lock chamber. Thetransfer chamber comprises a chamber body defining a transfer volume, anoptically transparent lid coupled to the chamber body, and a robotdisposed in the transfer volume, wherein a blade of the robot ismanufactured from quartz. The apparatus also includes a plurality ofpurge gas ports disposed in the chamber body, a plurality of diffusersextending from the purge gas ports, an exhaust port disposed in thechamber body opposite the plurality of purge gas ports, an exhaustconduit coupled to the exhaust port, and an oxygen sensor in fluidcommunication with the transfer volume via the exhaust conduit and theexhaust port.

In one implementation, the oxygen sensor has an oxygen concentrationsensitivity of less than about 1 part per million oxygen.

In one implementation, the oxygen sensor is coupled to the exhaustconduit via a first conduit and a second conduit.

In one implementation, a platform apparatus comprises a first factoryinterface, a second factory interface coupled to the first factoryinterface, and a tunnel chamber disposed between the first factoryinterface and the second factory interface, wherein the tunnel chambercomprises a transfer chamber and a plurality of load lock chamber. Theapparatus also includes a first transfer module coupled to the firstfactory interface, a process module coupled to the first transfermodule, a central transfer chamber coupled to the second factoryinterface, and a plurality of process chambers coupled to the centraltransfer chamber, wherein at least one of the plurality of processchambers is coupled to the central transfer chamber by a second transfermodule.

In one implementation, the first and second transfer modules comprise aload lock chamber and a transfer chamber.

In one implementation, the load lock chamber and the transfer chambergenerate a substantially inert environment at about atmosphericpressure.

In one implementation, the load lock chamber is coupled between thefirst factory interface and the transfer chamber.

In one implementation, the transfer chamber is coupled between the loadlock chamber and the process module.

In one implementation, the process module comprises a laser thermalprocess chamber.

In one implementation, the process module comprises a lamp based thermalprocess chamber.

In one implementation, a first process chamber of the plurality ofprocess chambers comprises a deposition chamber.

In one implementation, a second process chamber of the plurality ofprocess chambers comprises an etch chamber.

In one implementation, a third process chamber of the plurality ofprocess chamber comprises a cleaning chamber.

In one implementation, a platform apparatus comprises a first factoryinterface, a transfer module coupled to the first factory interface, aprocess module coupled to the transfer module, a second factoryinterface, and a central transfer chamber coupled to the second factoryinterface. The apparatus also includes a tunnel chamber disposed betweenthe first factory interface and the central transfer chamber, whereinthe tunnel chamber comprises a transfer chamber and a plurality of loadlock chambers. The apparatus also includes a plurality of processchamber coupled to the central transfer chamber.

In one implementation, the transfer module comprises a load lock chamberand a transfer chamber.

In one implementation, the transfer module generates a substantiallyinert environment at about atmospheric pressure.

In one implementation, the load lock chamber is coupled between thefirst factory interface and the transfer chamber.

In one implementation, the transfer chamber is coupled between the loadlock chamber and the process module.

In one implementation, the process module comprises a laser thermalprocess chamber.

In one implementation, the process module comprises a lamp based thermalprocess chamber.

In one implementation, a first process chamber of the plurality ofprocess chambers is a deposition chamber.

In one implementation, a second process chamber of the plurality ofprocess chambers is an etch chamber.

In one implementation, the tunnel chamber transfer chamber is disposedbetween the plurality of tunnel chambers and load lock chambers.

In one implementation, a substrate process method comprises transferringa substrate from a first chamber to a second chamber, isolating anenvironment of the second chamber from an environment of the firstchamber, removing oxygen from the environment of the second chamber, andcooling the substrate in the second chamber. The method also includesopening a slit valve between the first chamber and the second chamber,evacuating the environment of the first chamber, and analyzing the firstchamber exhaust to determine an oxygen concentration of the environmentof the second chamber.

In one implementation, the environment of the first chamber ismaintained at about atmospheric pressure during transfer of thesubstrate.

In one implementation, the environment of the second chamber ismaintained at about atmospheric pressure during transfer of thesubstrate.

In one implementation, the environment of the first chamber ismaintained under vacuum during transfer of the substrate.

In one implementation, the environment of the second chamber ismaintained under vacuum during transfer of the substrate.

In one implementation, the removing oxygen from the environment of thesecond chamber comprises purging the environment of the second chamberwith an inert gas.

In one implementation, the inert gas is nitrogen.

In one implementation, the environment of the second chamber ismaintained at above atmospheric pressure during cooling of thesubstrate.

In one implementation, a pressure of the environment of the secondchamber during the cooling of the substrate is between about 1 psi andabout 10 psi above atmospheric pressure.

In one implementation, a substrate process method comprises transferringa substrate from a transfer chamber to a load lock chamber, closing aslit valve between the transfer chamber and the load lock chamber toisolate an environment of the load lock chamber from an environment ofthe transfer chamber, removing oxygen from the environment of the loadlock chamber, and cooling the substrate in the load lock chamber. Themethod also includes opening the slit valve between the transfer chamberand the load lock chamber, evacuating the environment of the transferchamber during opening of the slit valve, and analyzing the transferchamber exhaust to determine an oxygen concentration of the environmentof the load lock chamber during the cooling of the substrate.

In one implementation, the environment of the transfer chamber ismaintained at about atmospheric pressure during transfer of thesubstrate.

In one implementation, the environment of the load lock chamber ismaintained at about atmospheric pressure during transfer of thesubstrate.

In one implementation, the environment of the transfer chamber ismaintained under vacuum during transfer of the substrate.

In one implementation, the environment of the load lock chamber ismaintained under vacuum during transfer of the substrate.

In one implementation, the removing oxygen from the environment of theload lock chamber comprises purging the environment of the load lockchamber with nitrogen gas.

In one implementation, a pressure of the environment of the load lockchamber during the cooling of the substrate and the purging is betweenabout 1 psi and about 10 psi above atmospheric pressure.

In one implementation, an oxygen concentration in the environment of theload lock chamber during the cooling of the substrate is less than about1 ppm.

In one implementation, a substrate transfer method comprisestransferring a substrate from a process chamber to a transfer chamber,transferring the substrate from the transfer chamber to a load lockchamber, and closing a slit valve between the transfer chamber and theload lock chamber to isolate an environment of the load lock chamberfrom an environment of the transfer chamber. The method also includesremoving oxygen from the environment of the load lock chamber, coolingthe substrate in the load lock chamber, opening the slit valve betweenthe transfer chamber and the load lock chamber, evacuating theenvironment of the transfer chamber during opening of the slit valve,and analyzing the transfer chamber exhaust to determine an oxygenconcentration of the environment of the load lock chamber during coolingof the substrate.

In one implementation, the process chamber is a laser thermal processchamber

In one implementation, environments of each of the process chamber, thetransfer chamber, and the load lock chamber are maintained at aboutatmospheric pressure during transfer of the substrate.

While the foregoing is directed to implementations of the presentdisclosure, other and further implementations of the disclosure may bedevised without departing from the basic scope thereof, and the scopethereof is determined by the claims that follow.

What is claimed is:
 1. A substrate processing apparatus, comprising: afactory interface; a substrate transfer module, comprising: a load lockchamber coupled to the factory interface, the load lock chamber having achamber body defining a process volume and a purge gas port in fluidcommunication with the process volume; a transfer chamber coupled to theload lock chamber; and a process module coupled to the substratetransfer module, wherein the process module comprises a plurality ofprocess chambers.
 2. The apparatus of claim 1, wherein the factoryinterface further comprises: a plurality of front opening unified podscoupled to the factory interface.
 3. The apparatus of claim 1, whereinthe substrate transfer module comprises a pair of load lock chambers. 4.The apparatus of claim 1, wherein the substrate transfer modulecomprises a pair of transfer chambers.
 5. The apparatus of claim 1,wherein the load lock chamber comprises: an exhaust port in fluidcommunication with the process volume.
 6. The apparatus of claim 5,wherein the load lock chamber comprises: a pedestal disposed in theprocess volume, wherein the pedestal has a plurality of cooling fluidconduits formed therein.
 7. The apparatus of claim 1, wherein the loadlock chamber has a first slit valve formed in the chamber body adjacentto the factory interface and a first slit valve door coupled to thechamber body adjacent to the first slit valve.
 8. The apparatus of claim7, wherein the load lock chamber has a second slit valve formed in thechamber body adjacent to the transfer chamber and a second slit valvedoor coupled to the chamber body adjacent to the second slit valve. 9.The apparatus of claim 8, wherein a second transfer chamber comprises: achamber body; an exhaust port disposed in the chamber body; and anexhaust conduit coupled to the chamber body and extending from theexhaust port.
 10. The apparatus of claim 1, wherein each of the processchambers is a rapid thermal process chamber.
 11. The apparatus of claim10, wherein each of the rapid thermal process chambers is a laserthermal process chamber.
 12. The apparatus of claim 11, wherein each ofthe laser thermal process chambers is operated at about atmosphericpressure.
 13. A substrate processing apparatus, comprising: a factoryinterface, wherein the factory interface comprises: a first transferchamber having a first robot disposed therein; a substrate transfermodule comprising: a load lock chamber coupled to the first transferchamber; a second transfer chamber having a second robot disposedtherein, the second transfer chamber coupled to the load lock chamber;and a process module coupled to the substrate transfer module, whereinthe process module comprises a process chamber, wherein the processchamber is coupled to the second transfer chamber.
 14. The apparatus ofclaim 13, wherein the process chamber is a laser thermal processchamber.
 15. The apparatus of claim 13, wherein the process chamber is adeposition chamber.
 16. The apparatus of claim 13, wherein the processchamber is an etch chamber.
 17. The apparatus of claim 13, wherein theload lock chamber comprises: a chamber body defining a process volume; apurge gas port in fluid communication with the process volume; and anexhaust port in fluid communication with the process volume.
 18. Theapparatus of claim 17, wherein the load lock chamber comprises: apedestal disposed in the process volume, wherein the pedestal has aplurality of cooling fluid conduits formed therein.
 19. A substrateprocessing method, comprising: transferring a substrate from a firstchamber to a second chamber; isolating an environment of the secondchamber from an environment of the first chamber; removing oxidants fromthe environment of the second chamber; cooling the substrate in thesecond chamber; opening a slit valve between the first chamber and thesecond chamber; evacuating the environment of the first chamber; andanalyzing the first chamber exhaust to determine an oxygen concentrationof the environment of the second chamber.
 20. The method of claim 19,wherein the removing oxidants from the environment of the second chambercomprises purging the environment of the second chamber with an inertgas.